IPG Photonics GLPN-40-1-20-M

Nanosecond laser for precision laser scribing and cutting.

Our workhorse for laser cutting and scribing with high precision four-axis stage and a high-performance galvanometer scanner for repeatable µm accuracy at high speed.

Laser micromachining

Investigations into the application of lasers for micromachining of silicon are also being carried out, including the drilling and scribing of deep vias and trenches and the initiation of crystal plane selective silicon etching. Rapid creation of deep features with minimal micro-cracking or laser induced damage is relevant to various complex solar cell designs, and also allows for the utilisation of various test structures that can be used for characterision of laser and other solar cell fabrication processes.


  • Pulse width: 1.5 ns (typical)
  • Wavelength: 532 nm
  • Repetition rate: 10-500 kHz
  • Power: 20 W
  • Beam profile: Gaussian beam profile
  • Micromachining setup: Four-axis stage with µm accuracy and 200 mm xy-scan range, Galvoscanner unit
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Nanosecond laser for precision laser scribing and cutting